Methods and apparatus for reducing an electronic device manufacturing tool footprint

ABSTRACT

In at least one aspect, a method includes positioning a load lock of an electronic device manufacturing tool such that the load lock occupies a first floor area; and positioning a mainframe power supply in a second floor area, wherein a substantial portion of the second floor area is within the first floor area, thereby reducing the electronic device manufacturing tool footprint. Additionally, or alternatively, a mainframe controller may be placed so that the footprint thereof substantially overlaps the footprint of the load lock. Numerous other aspects are also provided.

The present application claims priority from U.S. Provisional PatentApplication Ser. No. 60/587,110, Filed Jul. 12, 2004 (Attorney DocketNo. 9081/L), which is hereby incorporated by reference herein in itsentirety.

FIELD OF THE INVENTION

The present invention relates generally to electronic devicemanufacturing, and more particularly to methods and apparatus forreducing an electronic device manufacturing tool footprint.

BACKGROUND

FIG. 1 illustrates a conventional electronic device manufacturing tool(or system) 101. With reference to FIG. 1, the electronic devicemanufacturing tool 101 includes components, such as a mainframe powersupply (e.g., a mainframe power box) 103 and a mainframe controller 105,coupled to a mainframe 107. The mainframe 107 may include one or moreprocessing chambers 109, each of which is coupled to a respectiveprocessing chamber power box 110 and processing chamber controller 111,and a transfer chamber 112 coupled to a load lock 113. A footprint ofthe electronic device manufacturing tool 101 is the area of a floor(e.g., in a clean room) 115 occupied by the electronic devicemanufacturing tool 101. The mainframe power box 103 and mainframecontroller 105 are coupled to a rack 117 (e.g., an enclosure rack)separate from the mainframe 107. Therefore, the mainframe power box 103and controller 105 occupy a floor space 118 separate from the mainframeof the electronic device manufacturing tool 101, thereby increasing theelectronic device manufacturing tool's footprint.

Further, the mainframe power box 103 and controller 105 are coupled tothe mainframe 107 via wiring 119, which extends from the separate rack117 to the mainframe 107. Therefore, the farther the separate rack 117is located from the mainframe 107, the more wiring 119 is required bythe electronic device manufacturing tool 101, which reduces systemintegration. As described below, reducing the electronic devicemanufacturing tool footprint may increase tool (or system) integration.

Accordingly, methods and apparatus for reducing an electronic devicemanufacturing tool footprint are desired.

SUMMARY OF THE INVENTION

In a first aspect of the invention, a first method is provided forreducing an electronic device manufacturing tool's footprint. The firstmethod includes the steps of (1) positioning a load lock of anelectronic device manufacturing tool such that the load lock occupies afirst floor area; and (2) positioning a mainframe power supply in asecond floor area, wherein a substantial portion of the second floorarea is within the first floor area, thereby reducing the electronicdevice manufacturing tool footprint.

In a second aspect of the invention, a second method is provided forreducing an electronic device manufacturing tool footprint. The secondmethod includes the steps of (1) positioning a load lock of anelectronic device manufacturing tool such that the load lock occupies afirst floor area; and (2) positioning a mainframe controller in a secondfloor area, wherein a substantial portion of the second floor area iswithin the first floor area, thereby reducing the electronic devicemanufacturing tool footprint.

In a third aspect of the invention, a third method is provided forreducing an electronic device manufacturing tool shipping cost. Thethird method includes the steps of (1) placing a load lock and amainframe power supply of an electronic device manufacturing tool into acontainer; and (2) shipping the container.

In a fourth aspect of the invention, a fourth method is provided forreducing an electronic device manufacturing tool shipping cost. Thefourth method includes the steps of (1) placing a load lock and amainframe controller of an electronic device manufacturing tool into acontainer; and (2) shipping the container.

In a fifth aspect of the invention, a first apparatus is provided forreducing an electronic device manufacturing tool footprint. The firstapparatus includes (1) a load lock frame; (2) a load lock of anelectronic device manufacturing tool coupled to the load lock frame suchthat the load lock occupies a first floor area; and (3) a mainframepower supply coupled to the load lock frame such that the mainframepower supply occupies a second floor area. A substantial portion of thesecond floor area is within the first floor area, thereby reducing theelectronic device manufacturing tool footprint.

In a sixth aspect of the invention, a second apparatus is provided forreducing an electronic device manufacturing tool footprint. The secondapparatus includes (1) a load lock frame; (2) a load lock of anelectronic device manufacturing tool coupled to the load lock frame suchthat the load lock occupies a first floor area; and (3) a mainframecontroller coupled to the load lock frame such that the mainframecontroller occupies a second floor area. A substantial portion of thesecond floor area is within the first floor area, thereby reducing theelectronic device manufacturing tool footprint.

In a seventh aspect of the invention, a third apparatus is provided thatincludes (1) an electronic device manufacturing tool having a mainframethat occupies a first footprint, and (2) a mainframe power supply thatoccupies a second footprint that substantially overlaps the firstfootprint.

In an eighth aspect of the invention, a fourth apparatus is providedthat includes (1) an electronic device manufacturing tool having amainframe that occupies a first footprint, and (2) a mainframecontroller that occupies a second footprint that substantially overlapsthe first footprint. Numerous other aspects are provided, as are systemsand apparatus in accordance with these and other aspects of theinvention.

Other features and aspects of the present invention will become morefully apparent from the following detailed description, the appendedclaims and the accompanying drawings.

BRIEF DESCRIPTION OF THE FIGURES

FIG. 1 illustrates a conventional electronic device manufacturing tool.

FIG. 2 illustrates an exemplary electronic device manufacturing tool inaccordance with an embodiment of the present invention.

DETAILED DESCRIPTION

The present invention relates to increasing the integration and reducingthe footprint of an electronic device manufacturing tool (or system).FIG. 2 illustrates an exemplary electronic device manufacturing tool (orsystem) 201 in accordance with an embodiment of the present invention.The electronic device manufacturing tool 201 may be employed tomanufacture and/or process substrates such as glass or polymersubstrates used to manufacture flat panel displays, semiconductorwafers, etc. With reference to FIG. 2, the configuration of theexemplary electronic device manufacturing tool 201 is similar to theconfiguration of the conventional electronic device manufacturing tool101 of FIG. 1. More specifically, the exemplary electronic devicemanufacturing tool 201 includes a mainframe 203. The mainframe 203includes one or more processing chambers 205, each of which is coupledto a respective processing chamber power box 206 and processing chambercontroller 207, a transfer chamber 208 and a load lock 209. The loadlock 209 is supported by a load lock rack 211.

A mainframe power box (e.g., power supply) 213 of the exemplaryelectronic device manufacturing tool 201, which provides power to themainframe 203 and to each processing chamber power box 206, ispositioned differently than is the mainframe power box 103 of theconventional electronic device manufacturing tool 101. Morespecifically, the load lock 209 is positioned (e.g., on the load lockrack 211) such that the load lock 209 occupies a first floor area 215,and the mainframe power box 213 is positioned to occupy a second floorarea 217, a substantial portion of which is included in the first floorarea 215. For example, the first floor area 215 may include the entiresecond floor area 217. The mainframe power box 213 is adapted to coupleto the load lock rack 211. For example, the mainframe power box 213 maycouple to and be supported by the load lock rack 211 and/or be anintegral part of the load lock 209. For example, the mainframe power box213 may be positioned below the load lock 209. However, the mainframepower box 213 may assume other positions, such as above the load lock209. Therefore, according to the configuration of the exemplaryelectronic device manufacturing tool 201, the load lock 209 and themainframe power box 213 occupy at least substantially overlapping floorareas. In this manner, the footprint of the electronic devicemanufacturing tool 201 is reduced. Reducing the electronic devicemanufacturing tool footprint may reduce a required clean room size,which may lower the cost of operating the tool.

Alternatively or additionally, in a similar manner to that describedabove, a mainframe controller 218 of the exemplary electronic devicemanufacturing tool 201 may be positioned differently than is themainframe controller 105 of the conventional electronic devicemanufacturing tool 101. For example, in embodiments in which both themainframe power box 213 and the mainframe controller 218 are positionedso as to reduce the footprint of the manufacturing tool 101, themainframe controller 218 is positioned to occupy a floor area (e.g., athird floor area) 219, a substantial portion of which is included withinthe first floor area 215. For example, the first floor area 215 mayinclude at least 50 percent of, or preferably the entire third floorarea 219. The mainframe controller 218 may be adapted to couple to andbe supported by the load lock rack 211. For example, the mainframecontroller 218 may couple to a side of the load lock rack 211 oppositethe side of the load lock rack 211 to which the mainframe power box 213is coupled. Alternatively, the mainframe controller 218 may be coupledto other portions or sides of the load lock rack 211. Further, themainframe controller 218 may be positioned above or below the load lock209. Therefore, according to the exemplary configuration shown in FIG.2, the load lock 209 and the mainframe controller 218 occupy overlappingfloor areas. In this manner, the footprint of the electronic devicemanufacturing tool 201 is reduced.

The position of the mainframe power box 213 and/or the mainframecontroller 218 of the inventive electronic device manufacturing tool 201may allow wiring 220 between the mainframe power box 213 and/or themainframe controller 218 and other components of the electronic devicemanufacturing tool 201 to be reduced. More specifically, because of theposition of the mainframe power box 213 and/or the mainframe controller218, the electronic device manufacturing tool 201 does not requirewiring to be run from a separate enclosure to the mainframe 203 in orderto couple the mainframe power box 213 and/or the mainframe controller218 to the mainframe 203. The wiring 220 between the mainframe power box213 and/or the mainframe controller 218 and the mainframe 203 may fitcompactly within the mainframe footprint. Therefore, in addition toreducing the footprint of the electronic device manufacturing tool, thepresent methods and apparatus may increase system integration and reducesystem complexity.

In accordance with an embodiment of the present invention the exemplaryelectronic device manufacturing tool 201 may be transported (e.g.,shipped) more efficiently than the conventional electronic devicemanufacturing tool 101. More specifically, conventionally, the mainframepower box 103 and mainframe controller 105 are shipped separately fromthe load lock 113 of the conventional electronic device manufacturingtool 101. In contrast, the mainframe power box 213 of the inventiveelectronic device manufacturing tool 201 may be shipped with the loadlock 209. As described above, the mainframe power box 213 may be adaptedto couple to the load lock rack 211 and occupy an overlapping footprintwith the load lock 209. Therefore, the load lock 209 and the mainframepower box 213 of the inventive electronic device manufacturing tool 201(e.g., which may both be assembled to the load lock rack 209) may beshipped in the same container. By shipping the load lock 209 and themainframe power box 213 in the same container, a total number ofcontainers required to ship the exemplary electronic devicemanufacturing tool 201 is reduced. Consequently, the electronic devicemanufacturing tool shipping cost is reduced. Alternatively oradditionally, in a similar manner, the mainframe controller 218 may beshipped in the same container as the load lock 209.

The foregoing description discloses only exemplary embodiments of theinvention. Modifications of the above disclosed apparatus and methodswhich fall within the scope of the invention will be readily apparent tothose of ordinary skill in the art. In one or more embodiments, asubstantial portion (e.g., at least 50 percent, and preferably 100percent) of the floor area occupied by the mainframe power box 213and/or the mainframe controller 218 (e.g., a second and/or third floorarea, respectively) is within the floor area occupied by the load lock209 (e.g., a first floor area 215). However, in other embodiments, asubstantial portion of the floor area occupied by the mainframe powerbox 213 and/or the mainframe controller 218 may be within the floor areaoccupied by another component of the electronic device manufacturingtool 201. For example, the mainframe power box 213 and/or the mainframecontroller 218 may be coupled to another component of the electronicdevice manufacturing tool 201 or to a support rack of that component.

Accordingly, while the present invention has been disclosed inconnection with exemplary embodiments thereof, it should be understoodthat other embodiments may fall within the spirit and scope of theinvention, as defined by the following claims.

1. A method of reducing an electronic device manufacturing toolfootprint, comprising: positioning a load lock of an electronic devicemanufacturing tool such that the load lock occupies a first floor area;and positioning a mainframe power supply in a second floor area, whereina substantial portion of the second floor area is within the first floorarea, thereby reducing the electronic device manufacturing toolfootprint.
 2. The method of claim 1 wherein positioning the mainframepower supply in the second floor area, wherein a substantial portion ofthe second floor area is within the first floor area, includespositioning the mainframe power supply in the second floor area, whereinall of the second floor area is within the first floor area.
 3. Themethod of claim 1 further comprising reducing wiring required by theelectronic device manufacturing tool.
 4. The method of claim 1 furthercomprising positioning a mainframe controller in a third floor area,wherein a substantial portion of the third floor area is within thefirst floor area, thereby reducing the electronic device manufacturingtool footprint.
 5. The method of claim 4 wherein positioning themainframe controller in the third floor area, wherein a substantialportion of the third floor area is within the first floor area, includespositioning the mainframe controller in the third floor area, whereinall of the third floor area is within the first floor area.
 6. A methodof reducing an electronic device manufacturing tool footprint,comprising: positioning a load lock of an electronic devicemanufacturing tool such that the load lock occupies a first floor area;and positioning a mainframe controller in a second floor area, wherein asubstantial portion of the second floor area is within the first floorarea, thereby reducing the electronic device manufacturing toolfootprint.
 7. The method of claim 6 wherein positioning the mainframecontroller in the second floor area, wherein a substantial portion ofthe second floor area is within the first floor area, includespositioning the mainframe controller in the second floor area, whereinall of the second floor area is within the first floor area.
 8. Themethod of claim 6 further comprising reducing wiring required by theelectronic device manufacturing tool.
 9. The method of claim 6 furthercomprising positioning a mainframe power supply in a third floor area,wherein all of the third floor area is within the first floor area. 10.A method of reducing an electronic device manufacturing tool shippingcost, comprising: placing a load lock and at least one of a mainframepower supply and a mainframe controller of an electronic devicemanufacturing tool into a container; and shipping the container.
 11. Themethod of claim 10 further comprising placing both the main frame powersupply and the mainframe controller of the electronic devicemanufacturing tool into the container prior to shipping.
 12. Anapparatus for reducing an electronic device manufacturing toolfootprint, comprising: a load lock frame; a load lock of an electronicdevice manufacturing tool coupled to the load lock frame such that theload lock occupies a first floor area; and a mainframe power supplycoupled to the load lock frame, such that the mainframe power supplyoccupies a second floor area wherein a substantial portion of the secondfloor area is within the first floor area, thereby reducing theelectronic device manufacturing tool footprint.
 13. The apparatus ofclaim 12 wherein all of the second floor area is within the first floorarea.
 14. The apparatus of claim 12 further comprising a mainframecontroller coupled to the load lock frame such that the mainframecontroller occupies a third floor area, wherein a substantial portion ofthe third floor area is within the first floor area, thereby reducingthe electronic device manufacturing tool footprint.
 15. The apparatus ofclaim 14 wherein all of the third floor area is within the first floorarea.
 16. An apparatus for reducing an electronic device manufacturingtool footprint, comprising: a load lock frame; a load lock of anelectronic device manufacturing tool coupled to the load lock frame suchthat the load lock occupies a first floor area; and a mainframecontroller coupled to the load lock frame such that the mainframecontroller occupies a second floor area, wherein a substantial portionof the second floor area is within the first floor area, therebyreducing the electronic device manufacturing tool footprint.
 17. Theapparatus of claim 16 wherein all of the second floor area is within thefirst floor area.
 18. The apparatus of claim 17 further comprising amainframe power supply coupled to the load lock frame such that themainframe power supply occupies a third floor area, wherein asubstantial portion of the third floor area is within the first floorarea, thereby reducing the electronic device manufacturing toolfootprint.
 19. The apparatus of claim 18 wherein all of the third floorarea is within the first floor area.
 20. An apparatus comprising: anelectronic device manufacturing tool having a mainframe that occupies afirst footprint, and a mainframe power supply that occupies a secondfootprint that substantially overlaps the first footprint.
 21. Theapparatus of claim 20 further comprising a mainframe controller thatoccupies a third footprint that substantially overlaps the firstfootprint.